Objective
Seeking a challenging management position where I can utilise my knowledge and experience of semiconductor manufacturing, process development, customer interaction and multicultural team skills.
Education
B.Sc. in Chemical Engineering, June 1990, Hogeschool Eindhoven, Eindhoven (Netherlands).
M.Sc. in Chemical Engineering, June 1994, Technische Faculteit Breda, Breda (Netherlands).
Nationality
The Netherlands.
Language
Excellent verbal and writing skills in Dutch and English.
Excellent verbal skills in German.
Profession Experience and Employment Details
FEI
June 2005 - present
Senior Program Manager NanoElectronics Europe (Eindhoven, the Netherlands)
- Managing Joint Development Programs and Product Acceptances at beta sites at semiconductor customers.
- Provide marketing input on new product features and enhancements from key customer sites.
- Engage customers and FEI applications and product engineering teams to develop robust use cases of Semiconductor lab and fab equipment.
- Drive press releases and joint publications with key customers.
- Supervision of applications engineers and site engineers in the field
Novellus Systems November 1995 - May 2005
Key Account Technology Manager PECVD (Portland, Oregon, USA)
August 2004 - June 2005
- Responsible for maintaining PTOR and increasing all PECVD market share for customers in Asia and Europe.
- Understand customer needs for advanced technologies (typical <130nm node) and provide this information to the R&D group.
- Helped R&D with optimising PECVD processes as well as developing complete new ones. Majority of development work is focussed low-k integration.
- Compile and evaluate (beta)-test data to determine appropriate limits and variables for process specifications.
- Assist with complex problems troubleshooting that impact the design success of current products or addresses design issues of future products or technologies.
- Majority of work is focussed on both FEOL and BEOL for 90nm and 65nm Cu-technology with roadmap responsibilities for 45nm technology node.
Technologist PECVD (Portland, Oregon, USA)
July 2002 - August 2004
- Responsible for maintaining PTOR and increasing market share for a specific PECVD layer and application for customers around the world.
- This position requires intensive interaction with customers around the world. Define objectives through strong interaction with Account Executives.
- Present process updates and roadmaps to Executive Management from customer and employer.
Account Technologist (Crolles, Fra)
January 2001 - July 2002
- Responsible for pre and post sale support of company products by providing technical support through sales presentations, product demonstrations and device integration assistance.
- Successfully managed product demo¡¦s for the entire product portfolio: PECVD, W-CVD, PVD, ECD, and HDP.
- Assist with troubleshooting of complex integration issues.
- This position requires broad knowledge of all Novellus products and its technology as well as device integration for various semiconductor devices such as DRAM, FLASH and Logic for technology nodes down to 65nm.
Sr. Field Process Engineer & Project Manager (Austin, Texas, USA)
March 1999 - January 2001
- Responsible for ensuring successful penetration of FEOL and BEOL applications at a customer developing 130nm Cu-technology products.
- Established operational objectives and assignments, and delegated assignments to subordinate managers to ensure successful installation, start-up and integration of state-of-the-art CVD, PVD and ECD systems.
- Objectives and progress were reviewed with senior management from employer and customer to define requirements to overcome tool-, process- and integration related issues.
- Supervision of field process engineer (1) and field service engineer (3)
Field Process Engineer (Eindhoven, the Netherlands)
November 1995 - March 1999
- Responsible for on-time tool start-up¡¦s, developing new dielectric processes and troubleshooting out of control process situations throughout the installed base and new installs in Europe.
- Provide support to overcome device integration related problems.
- Assisted Field Service Engineers with system maintenance and tool sustaining when needed in order to meet system up-time specifications and increase customer satisfaction.
Philips Semiconductors September 1991 ¡V November 1995
Resource Engineer Thin Films (Nijmegen, the Netherlands)
September 1991 - November 1995
- Responsible for development and sustaining of Back End Of Line dielectric processes.
- These processes include SiO2 IMD and a new PSG/SiN passivation stack.
- Gained in-depth knowledge of Process Integration through close collaboration with Integration group to review Wafer Yields, E-test and Product Lifetime Analyses.
- Assured deposition tools maintained their performance by assisting with tool maintenance and troubleshooting.
- Managed the introduction and acceptance of a new PECVD platform at MOS3.
Application Training
- Novellus deposition products (PECVD, HDP, PVD, ECD, W-CVD)
- Applied Materials CVD5000.
- FEI Expida (FIB/SEM), Strata (SEM)
- Watkins&Johnsons APCVD systems (998 and 999)
- Electrotechs ND6200
Various courses in Analytical Materials Characterisation (AVS), Vacuum Technology, PECVD technology, multilevel metallization, FEOL and BEOL process integration (CEI), statistical experiment design (Design-Ease and Stat-Ease), Project Management, FMEA course and 8D-technique (by Ford).
References:
References are available upon request. |
